The Deepcool DS9 is a high-performance thermal paste designed for those who need efficient heat transfer between their CPU, GPU, or other demanding components and their cooling systems. With a thermal conductivity of 6.5 W/mK and a density of 3.5 g/cm³, it ensures that heat is moved away from the processor quickly to maintain stable system temperatures during heavy workloads. This compound is formulated to be non-corrosive and non-curing, meaning it won't harden over time or damage your hardware, allowing it to remain effective throughout its lifespan. It operates reliably across a wide temperature range from -40°C to +120°C, making it suitable for both standard builds and more extreme setups. This 7.5g syringe provides a generous amount of thermal compound for multiple applications, ensuring you have enough material for your high-performance cooling needs.