The Deepcool DS9 is an elite grade thermal paste designed to optimize heat transfer between processors and their cooling systems. With a thermal conductivity of 6.5 W/mK and a density of 3.5 g/cm³, it efficiently draws heat away from CPUs, GPUs, and other high-performance components to maintain stable operating temperatures. This formula remains stable across a wide range of environments, functioning reliably from -40°C up to +120°C. To ensure a long-lasting installation, the paste is non-corrosive and does not cure over time, meaning it won't harden or degrade during use. The 5g syringe comes with an applicator cap for precise placement, and the package includes a 70% isopropyl alcohol prep pad and a cleaning sponge to help you properly prepare the hardware surfaces before application.